A Macroscopic and Microscopic study of different reliability tests of high peformance Printed Circuit Boards (PCBs)


The objectives of this project are:

  • Correlate Cycle to Failure (CTF) between ATC and IST tests;
  • Determine the effect of PCB features to Cycle to Failure in ATC and IST tests;
  • Build up failure time models to compare two different accelerated test methodologies;
  • Demonstrate how the test results can be related to the end use environment of the product by means of the proposed model;
  • Microscopic analysis on failed samples;
  • Propose hypothesis on the failure mechanism based on microscopic analysis and CTF results;
  • Build up mathematical model for PTH stress distribution.

Deliverable(s)

  • Build Life-stress model;
  • Statistical correlation between ATC & IST;
  • Statistical life and reliability prediction;
  • Hypothesis on failure mechanism& failure mode of different reliability tests;
  • Mathematical model for PTH stress distribution ;
  • Microscopic analysis on failed samples.

Project Commencement Date:
October, 2007

Project Completion Date:
August 31, 2008

Principal Investigator:
Dr. Winco K.C. Yung
Tel (852) 2766-6599

Project Team Member:
1.Dr. Winco K.C. Yung
2.Prof T.M. Yue
3.Mr. James Tam
4.Ms. Vivian Man